반도체 관련분야 전문박람회 모스크바반도체박람회가 Expocentre Moscow 전시장에서 개최될 예정입니다,

금번 박람회는 전 세계에서 관련분야 바이어와 유관기업이 참석하는 전문박람회로 관련 산업의 동향파악, 신기술 습득, 신규바이어 및 신규아이템 창출, 신사업영역 구상과 활발한 비즈니스의 교류의 장이 될 것이며 비즈니스의 새로운 플랫폼을 제시할 것입니다.

대한민국 대표 박람회 여행사인 (주)지오엑스포에서는 고객의 성공 비즈니스와 고객 만족을 최우선으로 박람회 참석 프로그램을 준비하였습니다.

(주)지오엑스포의 참석프로그램은 박람회 참석에 적합한 항공여정과 검증된 호텔을 우선적으로 마련했으며 박람회 전문 가이드를 배정해 귀사의 성공적인 비즈니스에 도움이 되도록 최선을 다하고 있습니다.아울러 일정 중 알찬 현지 문화 탐방 및 관광 일정을 마련해 단순박람회 참석 또는 출장 이상의 감동을 선사하도록 노력합니다. (주)지오엑스포의 박람회 전문 서비스를 통해 신시장 개척, 세계시장 트렌드파악, 신규 고부가가치사업 개척등 다양하고 알찬 비즈니스의 기회를 만드시기 바랍니다.

★샌프란반도체박람회	★상해반도체박람회	싱가포르 SEMICON	대만 SEMICON

■ PROCESS TECHNOLOGY
Developments in X-ray lithography,Soft x-ray exposure and Applications, Lithography Challenges & Opportunities, New Progress of Steppers, Low temperature etchings, SCALPEL, PREVAIL E-bean projection, Self cleaning processes and real-time etch rate monitoring for 2.25m device and below, Etching damage issues, Copper wiring, High current,low energy implantation,dose measurement and control system selection, Ion source super low energy implantor, Development and applications for focused ion beam(FIB), PVD/CVD barrier and seed layers for copper for sub 0.18m, Reliability of copper metallization for ULSI applications, Advanced wafer cleaning technology utilizing high current plasma removing native oxide, CMP processing technology and equipment, 0.25 - 0.18 micron Process Technology, Ultra-thin oxynitride formation by advanced batch technologies, Processes modeling , simulation and certification technology, Back side metal preparation technology for power devices, Trace impurity effect and behavior for gases in high purity plasma process, Limitation of Silicon Technology

■ MANUFACTURING TECHNOLOGY
Upgrading of existing fob lines using SMIF technology, New developments in yield management techniques for advanced wafer fab lines, Fabrication automations for high volume fab lines, Failure analysis , yield enhancement , particle and defect control Technology, New method for analyzing prove yield sensitivities to IC design, Method for calculating wafer test equipment random and systemic Yield Limits, Deep UV laser removal of organic surface contamination from semiconductor surfaces, Etching technologies and equipment using advanced plasma source, DPS and others, CVD technologies and equipment for high density plasma source, Critical requirements for very high quality processes in 300mm production, Flip Chip Technologies, MBE and MOCVD equipment and compound growth tech

■ MATERIALS
Clean Packaging Technology and Pre-packaging Processing Technology and Equipment for Compound Semiconductor Polished Wafer

■ TEST
QA programming in test production, Particle and defects inspection , evaluation and control, Test cost analysis, IC packaging

■ PACKAGING
Design , Modeling and Simulation for Packaging, Advanced Packaging Technologies
Assembly Interconnect Technology, Improving Reliability and Reducing Cost, Materials for Pcakaging

■ FLAT PANEL DISPLAY
Technical Development Trends and Market Prospects for FPD, Current Status and Development Trends for TFT-LCD Manufacturing Technology, Development Trends and Application Prospects for Reflective Color, LCD, New Progress in PDP Manufacturing Technology, Development Trends for Organic EL Display, The Application of OLED to Portable Machines, Technical Progress in Plastic LCD, Micro Display and Its Applications