¡á PROCESS TECHNOLOGY Developments in X-ray lithography,Soft x-ray exposure and Applications, Lithography Challenges & Opportunities, New Progress of Steppers, Low temperature etchings, SCALPEL, PREVAIL E-bean projection, Self cleaning processes and real-time etch rate monitoring for 2.25m device and below, Etching damage issues, Copper wiring, High current,low energy implantation,dose measurement and control system selection, Ion source super low energy implantor, Development and applications for focused ion beam(FIB), PVD/CVD barrier and seed layers for copper for sub 0.18m, Reliability of copper metallization for ULSI applications, Advanced wafer cleaning technology utilizing high current plasma removing native oxide, CMP processing technology and equipment, 0.25 - 0.18 micron Process Technology, Ultra-thin oxynitride formation by advanced batch technologies, Processes modeling , simulation and certification technology, Back side metal preparation technology for power devices, Trace impurity effect and behavior for gases in high purity plasma process, Limitation of Silicon Technology
¡á MANUFACTURING TECHNOLOGY Upgrading of existing fob lines using SMIF technology, New developments in yield management techniques for advanced wafer fab lines, Fabrication automations for high volume fab lines, Failure analysis , yield enhancement , particle and defect control Technology, New method for analyzing prove yield sensitivities to IC design, Method for calculating wafer test equipment random and systemic Yield Limits, Deep UV laser removal of organic surface contamination from semiconductor surfaces, Etching technologies and equipment using advanced plasma source, DPS and others, CVD technologies and equipment for high density plasma source, Critical requirements for very high quality processes in 300mm production, Flip Chip Technologies, MBE and MOCVD equipment and compound growth tech
¡á MATERIALS Clean Packaging Technology and Pre-packaging Processing Technology and Equipment for Compound Semiconductor Polished Wafer
¡á TEST QA programming in test production, Particle and defects inspection , evaluation and control, Test cost analysis, IC packaging
¡á PACKAGING Design , Modeling and Simulation for Packaging, Advanced Packaging Technologies Assembly Interconnect Technology, Improving Reliability and Reducing Cost, Materials for Pcakaging
¡á FLAT PANEL DISPLAY Technical Development Trends and Market Prospects for FPD, Current Status and Development Trends for TFT-LCD Manufacturing Technology, Development Trends and Application Prospects for Reflective Color, LCD, New Progress in PDP Manufacturing Technology, Development Trends for Organic EL Display, The Application of OLED to Portable Machines, Technical Progress in Plastic LCD, Micro Display and Its Applications